The primary cause of performance degradation in modern
integrated circuit (IC) systems is manufacturing process variations.
Specifically, variations in IC components (e.g. CMOS devices, metal
interconnects, etc.) result in performance uncertainties and inconsistencies.
For example, metal interconnect thickness is dependent upon the slurry thickness
in the chemical mechanical polishing step and the quality of the polishing pad.
Meanwhile, the effective channel length of each CMOS device depends on the
effectiveness of critical dimension (CD) controllability. As a result,
variations in metal interconnect width, thickness, etc. and variations in CMOS
device parameters such as gate oxide thickness, dopant density, and threshold
voltages result in substantial circuit performance inconsistencies: CMOS gate
delay time and voltage response, CMOS gate active and leakage power consumption,
metal interconnect delay time and voltage response, etc. Consequently, there is
a need to develop efficient techniques to analyze IC performance in the presence
of these variations.
Researchers at Arizona State University have developed a
method to analyze IC system performance. By incorporating the method into a
software program, the method can generate IC system response (e.g. delay time,
voltage response, etc.) corresponding to various IC system components such metal
interconnects or CMOS devices. This technique normalizes the variables
corresponding to a particular IC system and models the system using an infinite
dimensional Hilbert space and a series of orthogonal polynomials. The technique
solves for the coefficients of the series of orthogonal polynomials using at
least one of a first equation representative of the IC system and a simulated
response of an IC system.
Potential Applications
- Analysis of Electrical Response Characteristics of
Interconnect Wires (e.g. on-chip ULSI interconnects)
- Networks of Passive Electrical Components
Benefits and Advantages
- Custom Accuracy of Analysis – method can provide an
expansion of any order depending on accuracy requirements and computational
resources as compared to other methods, which only provide first or second
order expansions
- Improved Accuracy of Analysis – accounts for underlying
probability distribution of the random variables that represent the
interconnect system uncertainties; optimality is with respect to speed of
convergence
- Improved Solution Speed – provides significant speed
increases over the golden standard Monte Carlo simulations method (~100 times
faster)
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