Search Results - neural+prostheses

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  1. Method for Creating and Packaging 3-Dimensional Stacks of Biochips Containing Microelectro-Mechanical Systems
    This invention contains the following distinct novelties: 1. The ability to perform flip-chip based electronic packaging for a die that contains mechanical and electrically active MEMS (Micro Electromechanical System) structures. Currently, most MEMS packaging technology still use a old-fashioned (Gold or Aluminum) wire-bonding technology which...
    Published: 7/11/2014
    Inventor(s): Jemmy Sutanto, Jitendran Muthuswamy
    Keywords(s): Bio-Technology, Drug Screening, Fuel Cells & Energy, Materials & Electronics, Mechanical/Manufacturing, Medical Devices & Imaging, Neural Prostheses
    Category(s): Bioengineering, Medical & Sensors

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