This invention contains the following distinct novelties:
1. The ability to perform flip-chip based electronic
packaging for a die that contains mechanical and electrically active MEMS (Micro
Electromechanical System) structures. Currently, most MEMS packaging technology
still use a old-fashioned (Gold or Aluminum) wire-bonding technology which leads
to the increase in the overall final package dimensions and cost.
2. The ability to provide a semi-hermetic sealing
technology, which enables the active mechanical parts of MEMS to be extended
outside the die boundary, while simultaneously protecting the inner active MEMS
parts against liquid or environmental contamination. Currently, there is no
semi-hermetic technology that offers promising sealing performance for MEMS.
Traditional hermetic sealing technology is not applicable for MEMS as the fluid
used for underfill will flow and freeze the active MEMS parts.
3. Enable 3D (three dimensional) stacking of a combination
of MEMS and IC dies vertically along z-axis. This technology will enable the
development of a compact 3D stack of MEMS chips with more functionality than
what is currently achievable with existing technology.
4. Enables MCP (Multiple Chips-in-a-Package) which includes
a combination of IC and MEMS dies together on a single package.
Potential Applications
- Electronics packaging
- MEMS packaging
- Nanotechnology packaging
- Microfluidics packaging
- Packaging of micro or molecular energy harvesting
- Packaging for high density energy storage
Benefits and Advantages
- 3D stacks of moveable microsensors
- Aims to stack up to seven microchips
- High density cluster of microdevices within a small
space/volume
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For more information about the inventor(s) and their
research, please see
Dr.
Muthuswamy's directory webpage
Dr. Muthuswamy's
laboratory webpage
