Processes for building devices in heterogeneous systems, such as silicon on insulator (SOI) technology, are becoming increasingly popular, especially in light of the recent interest in employing novel heterostructures for use in flexible electronics and displays. Of the two leading processes, ion cut technology, which comprises implanting ions into...

As a result of the high current density running through integrated circuit interconnects, metal atoms in the conductor migrate from their positions and create voids in the material. As these voids form, the voids increasingly degrade the material until the interconnect fails. Researchers at Arizona State University have developed a new technique...

Semiconductor devices such as MEMS, MOSFETS, CMOS, nMOS, pMOS, and BiCMOS comprise integrated circuits that perform complex and fast operations. As the dimensions of these devices continue to decrease, manufacturers must also fabricate increasingly smaller contacts in order to optimize device speeds. Specifically, these contacts require nanometer...