Processes for building devices in heterogeneous systems, such as silicon on insulator (SOI) technology, are becoming increasingly popular, especially in light of the recent interest in employing novel heterostructures for use in flexible electronics and displays. Of the two leading processes, ion cut technology, which comprises implanting ions into...

Many different graphic file formats are used for storing graphics: JPEG, TIF, GIF, etc. Highly desirable characteristic for all still digital image compression formats are quality and compression size. JPEG 2000 was developed as an open, ISO compliant technology that improved upon the JPEG file format. With the increased use in digital imaging technology...

In the field of biochemical deposition, the use of organic molecules to modify the interface between metal and high-permittivity (K) material is a recent development with a wealth of applications. Generally, there have been two main approaches to molecular control over electronic device properties: 1) control of the electrical potential at the interface...

Recently, efforts have been made to obtain larger capacitance values in capacitors of semiconductor devices using noble metals such as ruthenium (Ru), platinum (Pt), iridium (Ir), and osmium (Os) as a lower electrode or an upper electrode of a capacitor. Chemical vapor deposition (CVD) is often used to deposit this metal over the entire wafer surface....

Semiconductor devices are manufactured on semiconductor wafers through a number of thermal, chemical, and physical processes. One such process is known as chemical mechanical planarization or polish (CMP). The CMP process uses chemical reactions and mechanical polishing to remove excess material. As the critical dimensions of the transistors built...

As a result of the high current density running through integrated circuit interconnects, metal atoms in the conductor migrate from their positions and create voids in the material. As these voids form, the voids increasingly degrade the material until the interconnect fails. Researchers at Arizona State University have developed a new technique...

In the manufacture of semiconductor devices, the substrate, usually Silicon, is oxidized to form an oxide layer at the surface prior to device fabrication. This oxide layer (such as SiO2 grown on a Si (100)) surface typically grows completely amorphous with little ordering in the first atomic layers near the interface. This can lead to thickness...